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Product name: heat conduction double-sided adhesive without substrate
Product structure:
Features: The product has good thermal conductivity and electrical insulation, high flexibility of surface bonding, high bonding strength for most substrates, good anti-aging performance, high shear strength, high bonding strength.
Product Application: LCD module of PCB chip for smart phone/tablet; The PEP module; OLED module; Heat conduction of secondary battery and charger modules.
The product name |
Color |
The thickness of the/mm |
Stripping forceN/cm |
Coefficient of thermal conductivi W/m·k |
Level of flame retardant |
No substrate heat conduction double-sided adhesive |
White |
0.1 |
2~4Adjustable |
0.7 |
UL94-V0 |
0.2 |
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0.3 |
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0.4 |